Sino-Telecom and SUES Establish Joint Innovation Center for Intelligent Connectivity and Information Security

Sino-Telecom and Shanghai University of Engineering Science (SUES) signed a strategic cooperation agreement on October 29, 2026, to jointly establish an innovation center focused on information security technologies for intelligent connectivity. The signing took place at the university during its 2026 international forum on frontier technologies in next-generation artificial intelligence.

Sino-Telecom Chairman Xie Hu and Li Yuanyuan, Dean of the School of Electronic and Electrical Engineering at SUES, signed on behalf of the two parties. SUES Vice President Xu Kaiyu and Zhang Hao, head of the Shanghai Artificial Intelligence Society, witnessed the signing. Building on their longstanding cooperation, the partners unveiled the joint innovation center.

Sino-Telecom Chairman Xie Hu and Dean Li Yuanyuan sign the cooperation agreement.

The unveiling ceremony for the joint innovation center.

The partnership brings together Sino-Telecom's work in communications networks, AI computing interconnection, cybersecurity and AI security with the university's approach to collaborative innovation across science, engineering and technology. The two parties plan to link research cooperation with the development of engineering talent.

At the forum, Sino-Telecom CTO Dr. Wu Zhiyuan delivered a presentation on optical network interconnection technologies for AI computing centers. He discussed how Scale-Across technologies can connect data centers across campuses, cities and regions to form a unified computing resource pool as AI infrastructure moves toward clusters with 100,000 accelerators. His presentation also examined emerging trends in optical data center interconnect (DCI) technologies.

Sino-Telecom CTO Dr. Wu Zhiyuan presents optical interconnection technologies for AI computing centers.

In his closing remarks, SUES President Lou Yongqi said AI is moving from advances in individual technologies toward integrated capabilities in real-world applications. He emphasized interdisciplinary collaboration and closer links between industry and education. The university is considering a new model for an AI school that would connect campus activities with industry and urban life, bringing businesses into collaborative education and innovation.

SUES President Lou Yongqi delivers closing remarks.

Sino-Telecom and the university's School of Electronic and Electrical Engineering plan to establish a long-term cooperation mechanism, with dedicated space at the company's new campus for the center. Planned research areas include 6G, integrated sensing and communication, artificial intelligence and data security, alongside the joint development of engineers with interdisciplinary innovation skills.

Sino-Telecom also plans an energy-storage green wall and computing facilities based on domestically developed GPUs at the new campus, as part of a modular AI data center (AIDC) concept. The proposed facilities are intended to support university AI model training, scientific research and enterprise R&D, while providing opportunities for practical training, research commercialization and entrepreneurship in the Songjiang University Town innovation ecosystem.