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Sino-Telecom Awarded Kunpeng Diamond Partner, Advancing Innovation in High-Performance Network Computing

Time: 2026-03-28

Nanjing, March 27, 2026 – At the 2026 Computing Component Partner Conference hosted by Huawei under the theme “Partner Collaboration for a Thriving Computing Component Ecosystem,” Huawei officially announced the annual Kunpeng KPN (Kunpeng Network) Ecosystem Partner Awards.

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Sino-Telecom Technology Co., Inc. was honored as a Kunpeng Computing Module Diamond Partner, the highest distinction in the category, in recognition of its strong innovation capabilities and deep ecosystem integration in high-performance network computing. In addition, the company received two further awards: the “2025 Kunpeng KPN Outstanding Contribution Award” and the “2025 Kunpeng KPN Best Product Award”.

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At the conference, Sino-Telecom delivered a keynote presentation titled Building a High-Performance Network Computing Foundation Based on Kunpeng Modules, outlining its integrated ecosystem spanning communications, AI computing, and network visibility, built on full-stack in-house R&D capabilities.

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The presentation highlighted three core products built on the Kunpeng 920 module:

  • Multi-node Modular Computing Platform MS8000: The platform is available in multiple configurations (1U 2-node, 2U 4-node, and 4U 8-node), providing flexible deployment options. Each node supports dual Kunpeng processors (32/48/64 cores optional), up to 512 GB of memory, and four 100G high-speed network interfaces, enabling high-density, energy-efficient, and maintainable computing infrastructure.
  • Orthogonal Kunpeng Computing Card SFC7940C: This computing card integrates four Kunpeng computing nodes on a single board, with backplane bandwidth reaching 800G. It supports fine-grained traffic steering rules, including 5-tuple, signature, HTTP, and domain-based filtering, meeting the requirements of high-throughput traffic analysis scenarios.
  • Intelligent Switch Server SFC7408: The 4U chassis accommodates eight Kunpeng computing nodes and integrates a 12.8T high-capacity switching chip, forming a next-generation computing-network convergence platform characterized by high-density heterogeneous computing, tight hardware-software coordination, and enhanced security.

Through successful deployments, Sino-Telecom demonstrated the efficient deployment and strong performance of its Kunpeng module-based solutions in areas such as IDC security, anti-fraud early warning, and public network traffic analysis and governance.

During the conference, the Chairman of Sino-Telecom led a delegation in strategic discussions with Huawei’s senior management. The two parties reached strong alignment on key topics including the evolution of the Kunpeng ecosystem, the integration of AI and network computing, and the technical roadmap for next-generation KPN modules, further strengthening collaboration in R&D, joint solution development, and market expansion.

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Being named a Diamond Partner, along with two additional major awards, represents strong recognition of Sino-Telecom’s technological capabilities and industry contributions in the high-performance computing sector.

Notably, over the past year, Sino-Telecom has made rapid progress within the Kunpeng ecosystem, advancing from Silver Partner to Gold Partner and ultimately to Diamond Partner. This progression reflects the company’s continued focus on technological advancement, product evolution, and ecosystem collaboration. From focused innovation to system-level integration, Sino-Telecom is strengthening its position across key segments of the computing industry through its differentiated capabilities in communications, AI computing, and network visibility.

Looking ahead, Sino-Telecom will continue to focus on building next-generation computing infrastructure defined by security, reliability, in-house innovation, and energy efficiency. Together with partners across the Kunpeng ecosystem, the company aims to foster an open and collaborative industry environment and contribute to the advancement of digital infrastructure.

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